• 5 years of experience in developing applications
  • Object-oriented programming
  • WPF, .Net 3.0 / 3.5, C#, Silverlight, SQL Server

3 hours ago

S$4k - 6k /month

Applied
  • Wirebond process development, Semiconductor, DOE
  • Leadframe, Gold, Copper, Aluminum wedge bonding
  • Statistical tools,Orthodyne, ASM, Shinkawa

28-Sep-16

 

Applied
  • Knowledge of Electrical and Electronics components
  • Experience in electronic design stimulation tools
  • Medical device industry preferred

27-Sep-16

 

Applied
  • Wi-Fi related software development
  • Wi-Fi related software porting
  • Customer support

26-Sep-16

Salary negotiable

Applied
  • Wireless AP software development
  • Router protocol development
  • Embedded system development

26-Sep-16

Salary negotiable

Applied
  • Responsible for Process technology development
  • Responsible for Wirebond Process characterization
  • Involved in critical Quality and Manufacturing.

21-Sep-16

 

Applied
  • Wireless AP software development
  • Router protocol development
  • Embedded system development

18-Sep-16

Salary negotiable

Applied
  • Wi-Fi related software development
  • Wi-Fi related software porting
  • Customer support

18-Sep-16

Salary negotiable

Applied
  • Bachelor Degree
  • Skillful in 2D visualization
  • interest in emerging front-end technologies

14-Sep-16

 

Applied
  • Web application development using JAVA/J2EE/HTML 5
  • Software project management.
  • Bachelors/Masters in Engineering/Computer Science

14-Sep-16

S$3k - 5k /month

Applied
  • See job description.
  • See job description.
  • See job description.

05-Sep-16

Salary negotiable

Applied
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