• Flip chip processes or die bonding
  • Assembly semiconductor processes experience
  • Degree in Engineering

17-Feb-17

 

Applied
  • Deliver applications integrations solutions
  • Deliver, deploy and support e-business processes
  • Implement end-to-end automated B2B processes

13-Feb-17

Salary negotiable

Applied
  • Specialization in the field of IC Design
  • 5 years of design experiences in mid-scale project
  • Design digital circuits in BCD technologies

13-Feb-17

Salary negotiable

Applied
  • 4 years exp in semiconductor or R&D environment
  • Conduct chip level functional test plan
  • Familiar with UNIX/Linux environment

09-Feb-17

Salary negotiable

Applied
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