Qualcomm and TDK Announce Launch of Joint Venture
—RF360 Holdings to Enable Delivery of RF front-end (RFFE) modules and RF filters into fully integrated systems for mobile devices, automotive and IoT
RF360 Holdings is a Qualcomm and TDK Joint Venture driving innovation in Radio Frequency Front End (RFFE). With over 4,000 employees worldwide, RF360 Holdings develops and manufactures innovative RFFE filtering solutions for mobile devices and fast growing business segments, such as IoT, drones, robotics, automotive applications and more.
RF360 Holdings offers a comprehensive portfolio of filters and filter technologies, including surface acoustic wave (SAW), temperature-compensated surface acoustic wave (TC-SAW) and bulk acoustic wave (BAW) solutions to support the wide range of frequency bands being deployed in networks across the globe.